A single layer of carbon atoms arranged in a hexagonal lattice. One atom thick. Stronger than steel at a fraction of the mass. More conductive than copper. More thermally efficient than any natural material. Transparent. Flexible. Impermeable to all gases. Manufactured at L4 Factory 3 Line 3A from asteroid-derived carbon at zero raw material cost. Available to Earth customers FOB Earth orbit from Month 21.
Graphene is a single atomic layer of carbon in sp² hybridization — each carbon atom bonded to three neighbours in a repeating hexagonal pattern extending in two dimensions. It is simultaneously the thinnest, strongest, most electrically conductive, and most thermally conductive material ever measured. These properties do not trade off against each other — they coexist in the same sheet because they all arise from the same underlying atomic geometry. At L4, graphene is produced from asteroid carbon at zero raw material cost. The only limitation on production volume is Factory 3 throughput.
Graphene is produced at L4 by chemical vapor deposition — the same CVD process used for diamond substrate production, adapted for two-dimensional sp² growth. The feedstock is methane derived from asteroid carbon via the Sabatier reaction. The energy source is the 239.4 MW mirror array. Raw material cost: zero. Energy cost: zero. Production is limited only by Factory 3 Line 3A throughput — which scales as the factory expands.
Graphene is a foundational material across the entire Speculāris programme. Every DRAD chip contains a graphene FET layer. Every battery in the system uses graphene electrodes. Every Tesla valve uses graphene panels. The programme could not function without it.
All graphene products are manufactured at L4 Factory 3 Line 3A from asteroid-derived carbon. Delivered FOB Earth orbit from Month 21 of L4 arrival. Ocean drop to customer EEZ coordinates available — same delivery mechanism as rare earth and DRAD chip products. Strategic investment partners receive 50% perpetual discount across all product lines.
| Product | Specification | Sizes available | Applications | Notes |
|---|---|---|---|---|
Graphene Monolayer Sheet GR-ML-SHEET |
Single atomic layer. CVD grown. Zero-G L4 production — lower defect density than terrestrial CVD. Transferred to target substrate or free-standing on support frame. | 200mm wafer · 300mm wafer · 500×500mm panel · 1×1m panel · Custom geometry on request | Semiconductor research. Barrier membranes. Sensor active layers. Optical windows (97.7% transmission). Fundamental materials research. | Specify substrate or free-standing. Support frame included for free-standing orders. |
Graphene Bilayer Sheet GR-BL-SHEET |
Two coupled graphene layers. Tunable bandgap via gate voltage — unlike monolayer. Both AB-stacked (Bernal) and twisted-angle configurations available. | 200mm wafer · 300mm wafer · Custom panel sizes | Bandgap-tunable transistor research. Photovoltaic active layers. Magic-angle superconductivity research (1.1° twist angle). | Twist angle specified at order time ±0.1°. AB-stacked is default. |
Graphene Few-Layer (3–10 layers) GR-FL-SHEET |
3 to 10 graphene layers. Approaching bulk graphite properties. Higher mechanical strength than monolayer. Specify layer count at order time. | 300mm wafer · 500×500mm panel · 1×1m panel · Roll format (500mm width, custom length) | Structural composite reinforcement. High-current electrode base layer. Thermal interface material. EMI shielding. | Layer count uniform ±1 layer across panel area. |
Graphene PCB Substrate GR-PCB-SUB |
Few-layer graphene on ceramic carrier, ready for PCB trace lithography. Thermal conductivity 5,300 W/m·K lateral dissipation. Compatible with standard PCB manufacturing processes. | Standard PCB panel sizes: 305×457mm · 406×457mm · Custom up to 600×600mm | High-power electronics PCBs. Radar and phased array boards. Nuclear instrumentation. Satellite avionics boards. Any application requiring thermal management beyond FR4 capability. | Ceramic carrier material specified by customer. Via drilling by conventional methods. |
Graphene/HND Electrode Sheet GR-HND-ELEC |
Graphene with hydrogenated nanocrystalline diamond surface treatment. Negative electron affinity. Enhanced charge/discharge characteristics for supercapacitor and battery applications. Solid-state compatible — no liquid electrolyte required. | 100×100mm cell format · 200×200mm · Custom electrode geometry | Supercapacitor electrode pairs. Solid-state battery cells. High-frequency power buffer in radiation environments. Space power systems. | HND treatment depth specified in nm. Cell pairs supplied matched within 2% capacitance. |
Graphene Oxide Sheet GR-OX-SHEET |
Graphene with controlled oxygen functional groups. Hydrophilic — water-dispersible. Interlayer spacing tunable by oxidation degree. Reduced graphene oxide (rGO) also available. | Dry sheet: 200×200mm · 500×500mm. Aqueous dispersion: 100mL · 1L · 10L (specify concentration mg/mL) | Composite material additive. Membrane fabrication. Filtration (water purification, desalination). Biomedical sensing. Ink formulations. | C:O ratio specified at order. rGO reduction degree specified as % oxygen removal. |
Graphene Armor Panel GR-ARMOR-PNL |
Multi-layer graphene composite panel on structural backing. Ballistic performance at fraction of steel mass. 200× tensile strength of steel. Configurable thickness for desired protection level. | 300×300mm · 500×500mm · 1×1m · Custom geometry. Thickness: 2mm · 5mm · 10mm · Custom | Aerospace structural panels. Satellite micrometeorite shielding. National defense force personal and vehicle protection. Industrial high-impact environments. | Backing material specified (carbon fiber, ceramic, metal matrix). Ballistic certification testing available at customer facility. |
Graphene Thermal Interface Material GR-TIM |
Few-layer graphene paste or film for chip-to-heatsink thermal interface. 5,300 W/m·K in-plane conductivity. Ultra-thin bond line for minimum thermal resistance. | Film: 50×50mm · 100×100mm · 200mm wafer. Paste: 10mL · 100mL syringe | DRAD chip packaging. High-power RF amplifier modules. Laser diode thermal management. Nuclear reactor instrumentation cooling. | Bond line thickness: 5–50μm film. Paste viscosity adjustable. Vacuum-compatible formulation standard. |
Graphene Gas Barrier Membrane GR-MEM-GAS |
Monolayer graphene on porous support structure. Perfect barrier to all gases in pristine form. Pore density and size functionalized for selective gas transport as specified. | 25mm disc · 47mm disc · 100mm disc · Custom frame mount | He-3/He-4 separation (complement to cryogenic). Hydrogen purification. Isotope separation research. Ultra-high vacuum sealing windows. Atmospheric sensor windows. | Pore functionalization chemistry specified at order. Support material: alumina, silicon nitride, or polymer mesh. |
Delivery: All products FOB Earth orbit. Reentry capsule ocean drop to customer EEZ coordinates available — same delivery chain as rare earth and DRAD chip products. JMSDF, national coast guard, or customer vessel recovery. Minimum order: No minimum — single wafers accepted. Lead time: Factory 3 Line 3A production schedule dependent — contact for current availability. Strategic investment partners receive 50% perpetual discount on all graphene products.
Graphene was first isolated by manually peeling layers from graphite with adhesive tape. It won the Nobel Prize in Physics in 2010. For fifteen years after that, it was produced in milligram quantities at laboratory scale, at enormous cost, for research applications. Speculāris produces it from asteroid carbon at L4 at zero raw material cost in quantities sufficient to supply any industrial customer on Earth.
The material that won the Nobel Prize is now a bulk industrial product manufactured 150 million kilometres from the nearest human being, from carbon that has been drifting in the asteroid belt for 4.6 billion years, waiting for a factory that could process it. The factory is here. The graphene is ready.
Speculāris — On the cutting edge.
All graphene products available from Month 21 of L4 arrival. Contact for specifications, quotation, and delivery scheduling.